The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Nov. 29, 2012
Applicant:

Ihp Gmbh—innovations for High Performance Microelectronics, Frankfurt (Oder), DE;

Inventors:

Martin Kittler, Frankfurt, DE;

Tzanimir Arguirov, Cottbus, DE;

Manfred Reiche, Halle, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/30 (2006.01); H01L 33/00 (2010.01); H01L 33/02 (2010.01); H01L 33/34 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01S 5/305 (2013.01); H01L 33/0037 (2013.01); H01L 33/025 (2013.01); H01L 33/34 (2013.01); H01L 33/0079 (2013.01); H01L 33/58 (2013.01);
Abstract

A light emitting semiconductor device according the invention includes an SOI substrate, a collector and an injector. The SOI substrate includes a carrier layer, a buried oxide layer on the carrier layer, and a doped silicon layer structure with a conductivity type. The doped silicon layer structure with the conductivity type includes at least two silicon- or silicon germanium layers arranged adjacent to one another, wherein a dislocation network is configured in their interface portions at which dislocation network a radiative charge carrier combination with a light energy is provided, which light energy is smaller than a band gap energy of the silicon- or silicon germanium layers. The collector is formed as a pn-junction in a portion between the dislocation network and a surface of the silicon layer structure that is oriented away from the carrier layer, and wherein the injector is configured as a metal insulator semiconductor diode.


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