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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9147818 B1

PDFFull Text
Date of Patent:
Sep. 29, 2015

Filed:

Nov. 07, 2012

Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Chiyoda-ku, JP;

Inventors:

Toshio Shiobara, Annaka, JP;

Tsutomu Kashiwagi, Annaka, JP;

Miyuki Wakao, Takasaki, JP;

Assignee:

Shin-Etsu Chemical Co., Ltd., Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Duy T Nguyen

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); C09K 11/77 (2006.01); H01L 33/50 (2010.01); H05B 33/14 (2006.01); H05B 33/20 (2006.01); C09D 183/04 (2006.01); C09K 11/02 (2006.01); C08G 77/12 (2006.01); C08G 77/14 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C09D 183/04 (2013.01); C09K 11/02 (2013.01); C09K 11/7721 (2013.01); H01L 33/50 (2013.01); H01L 33/501 (2013.01); H05B 33/14 (2013.01); H05B 33/20 (2013.01); C08G 77/12 (2013.01); C08G 77/14 (2013.01); C08G 77/20 (2013.01); H01L 33/505 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24372 (2015.01);
Abstract

A wavelength conversion sheet filled with a large amount of phosphor, enabling the phosphor to be easily dispersed uniformly and in a large amount near the surface of an LED element. Specifically, the sheet includes: a layer formed from a heat-curable resin composition, which contains 100 parts by mass of a resin component and 100 to 2,000 parts by mass of a particulate phosphor in which the proportion of particles having a sphericity of 0.7 to 1.0 is not less than 60% of all the particles, and which exists in a plastic solid or semisolid state in an uncured state at normal temperature, wherein the average particle diameter of the phosphor is not more than 60% of the thickness of the layer formed from the heat-curable resin composition, and the maximum particle diameter thereof is not more than 90% thereof.

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