The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Mar. 15, 2012
Applicants:

Yasuhiko Akaike, Fukuoka-ken, JP;

Yoshinori Natsume, Kanagawa-ken, JP;

Shinji Nunotani, Tokyo, JP;

Kazuyoshi Furukawa, Kanagawa-ken, JP;

Inventors:

Yasuhiko Akaike, Fukuoka-ken, JP;

Yoshinori Natsume, Kanagawa-ken, JP;

Shinji Nunotani, Tokyo, JP;

Kazuyoshi Furukawa, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 33/405 (2013.01); H01L 33/38 (2013.01); H01L 33/40 (2013.01);
Abstract

According to one embodiment, a semiconductor light emitting element includes a light emitting element includes a semiconductor stacked body including a light emitting layer, a reflection layer, a support substrate, a first bonding electrode and a second bonding electrode. The reflection layer is made of a metal and has a first surface and a second surface opposite to the first surface. The semiconductor stacked body is provided on a side of the first surface of the reflection layer. The first bonding electrode is provided between the second surface and the support substrate and includes a convex portion projected toward the support substrate and a bottom portion provided around the convex portion in plan view. The second bonding electrode includes a concave portion fitted in the convex portion of the first bonding electrode and is capable of bonding the support substrate and the first bonding electrode.


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