The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Jun. 16, 2014
Amazon Technologies, Inc., Reno, NV (US);
Eddie Alex Azuma, Pleasanton, CA (US);
Amazon Technologies, Inc., Reno, NV (US);
Abstract
Various embodiments are directed to a camera module, image sensor die, and methods for manufacturing the same. The image sensor die comprises a thinned wafer portion, a photosensor portion adjacent the thinned wafer portion and a carrier wafer. Vias may be formed through the carrier wafer to connect the photosensor portion to die contacts. A first side of the image sensor die opposite the die contacts may be bonded to a first side of the rigid substrate. Wire bonds may be formed between the die contacts and substrate-sensor contacts positioned on the first side of the rigid substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile