The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Sep. 12, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Hideo Nishiuchi, Kuwana, JP;

Kazuhiro Ueda, Aisai, JP;

Takayuki Masunaga, Yokkaichi, JP;

Naotake Watanabe, Mie-gun, JP;

Yoshiyuki Shimizu, Tokyo, JP;

Takashi Togasaki, Yokohama, JP;

Koji Maruno, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 25/00 (2006.01); H01L 23/50 (2006.01); H01L 25/07 (2006.01); H01L 23/473 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/40 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/4839 (2013.01); H01L 21/4842 (2013.01); H01L 23/473 (2013.01); H01L 23/49562 (2013.01); H01L 23/50 (2013.01); H01L 25/072 (2013.01); H01L 23/3107 (2013.01); H01L 23/4006 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract

According to one embodiment, a semiconductor power converter includes first and second electrical conductors opposed to each other, first and second semiconductor elements joined to a first joint surface of the first electrical conductor, first and second convex electrical conductors joined to the first and second semiconductor elements, a junction joined to the first and second convex electrical conductors and a second joint surface of the second electrical conductor, power terminals, signal terminals, and an envelope sealing the constituent members. The envelope includes a flat bottom surface which extends perpendicular to the semiconductor elements and in which first and second bottom surfaces of the electrical conductors are exposed.


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