The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Oct. 28, 2013
Renesas Electronics Corporation, Kawasaki-shi, JP;
Yoshiharu Kaneda, Kawasaki, JP;
RENESAS ELECTRONICS CORPORATION, Kawasaki-Shi, Kanagawa, JP;
Abstract
Each stitch part of a plurality of leads of a package has a first region having the most outer surface on which Ag plating is applied and a second region having the most outer surface on which Ni plating is applied. Further, the second region is arranged on a die pad side, and the first region is arranged on a periphery side of a sealer. Therefore, in each stitch part, types of plating applied on the most outer surfaces of the first region and the second region can be differentiated from each other, a thick Al wire can be connected to the second region of the second lead, and a thin Au wire can be connected to the first region of the first lead. As a result, usage of only Au plating can be avoided, so that the cost of the package is reduced.