The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Jul. 03, 2012
Applicants:
Koji Shimizu, Fukuoka, JP;
Masanori Mitsui, Fukuoka, JP;
Inventors:
Koji Shimizu, Fukuoka, JP;
Masanori Mitsui, Fukuoka, JP;
Assignee:
MITSUI HIGH-TEC, INC., Fukuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4951 (2013.01); H01L 21/4842 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 24/03 (2013.01); H01L 2224/48247 (2013.01);
Abstract
Provided is a lead frame by which a die pad can be easily exposed when the lead frame is used for a semiconductor device. The lead frame has a die pad with an upper surface on which a semiconductor element is mounted. The lead frame is used for the semiconductor device with the exposed surface of the die pad being exposed from a sealing resin. A downwardly-projecting first metal burr is formed along the peripheral portion of the exposed surface of the die pad and heads of the first metal burr are flat.