The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Nov. 30, 2011
Katsuhisa Kodama, Chiyoda-ku, JP;
Katsuhisa Kodama, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a semiconductor device capable of improving heat-radiating performance of a heating element. The semiconductor device of the present invention includes: a heating element (); a heat-radiating member () including an element contact portion () which is held surface contact with a mounting surface (); a first pressing member () and a second pressing member () held in contact with the heating element (); and a fixation screw () for fixing the first pressing member () to the heat-radiating member () through a through hole () formed through the first pressing member (). The first pressing member () and the second pressing member () each include an inclined surface formed so that a component force of an axial force of a tightening force of the fixation screw () is generated in a vertical direction with respect to the mounting surface ().