The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Mar. 05, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Andrea Carletti, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/4006 (2013.01); H01L 23/42 (2013.01); H01L 24/92 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip package. The semiconductor chip package is located between the printed circuit board and the heat sink. A heat-generating surface of the semiconductor chip package is oriented such that the heat-generating surface faces the heat sink.
Carletti, Andrea. (2015). Power semiconductor assembly and module (U.S. Patent No. 9147630). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9147630
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile