The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Aug. 22, 2013
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Yusaku Shimizu, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Tsuyoshi Torinari, Ibaraki, JP;
Daisuke Uenda, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki-shi, JP;
Abstract
A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.