The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Mar. 09, 2012
Applicants:

Hidekazu Takahashi, Tokyo, JP;

Masahiko Inoue, Tokyo, JP;

Hiroyuki Ochiai, Tokyo, JP;

Inventors:

Hidekazu Takahashi, Tokyo, JP;

Masahiko Inoue, Tokyo, JP;

Hiroyuki Ochiai, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16J 15/00 (2006.01); H01L 21/00 (2006.01); F16J 3/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/00 (2013.01); F16J 3/047 (2013.01); Y10T 29/41 (2015.01);
Abstract

An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate.


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