The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Mar. 06, 2012
Applicants:

Young Seuck Yoo, Seoul, KR;

Jeong Bok Kwak, Gyeonggi-do, KR;

Yong Suk Kim, Gyeonggi-do, KR;

Sang Moon Lee, Seoul, KR;

Kang Heon Hur, Gyeonggi-do, KR;

Sung Kwon WI, Seoul, KR;

Inventors:

Young Seuck Yoo, Seoul, KR;

Jeong Bok Kwak, Gyeonggi-do, KR;

Yong Suk Kim, Gyeonggi-do, KR;

Sang Moon Lee, Seoul, KR;

Kang Heon Hur, Gyeonggi-do, KR;

Sung Kwon Wi, Seoul, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonngi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/30 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 5/003 (2013.01); H01F 41/046 (2013.01); Y10T 29/49073 (2015.01);
Abstract

A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate.


Find Patent Forward Citations

Loading…