The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Mar. 28, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takanobu Manabe, Kawasaki, JP;

Toshiaki Kurosu, Oita, JP;

Makoto Watanabe, Yokohama, JP;

Masataka Nagai, Yokohama, JP;

Hiroyuki Murayama, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B21D 51/16 (2006.01); B21K 21/08 (2006.01); B23P 15/16 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0015 (2013.01);
Abstract

A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.


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