The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Aug. 31, 2012
Applicants:

Seng-kum Chan, Santa Clara, CA (US);

David J. K. Meadowcroft, San Jose, CA (US);

Inventors:

Seng-Kum Chan, Santa Clara, CA (US);

David J. K. Meadowcroft, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/02 (2006.01); H05K 1/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/4269 (2013.01); H05K 1/0209 (2013.01); H05K 7/2039 (2013.01); H05K 7/2049 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10174 (2013.01);
Abstract

Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.


Find Patent Forward Citations

Loading…