The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

May. 20, 2011
Applicants:

Takanori Aono, Hitachinaka, JP;

Kengo Suzuki, Hitachinaka, JP;

Akira Koide, Inashiki, JP;

Masahide Hayashi, Mito, JP;

Inventors:

Takanori Aono, Hitachinaka, JP;

Kengo Suzuki, Hitachinaka, JP;

Akira Koide, Inashiki, JP;

Masahide Hayashi, Mito, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); G01P 15/08 (2006.01); B81C 1/00 (2006.01); G01C 19/56 (2012.01); G01P 15/125 (2006.01); G01C 19/5783 (2012.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
G01P 15/0802 (2013.01); B81C 1/00293 (2013.01); G01C 19/56 (2013.01); G01C 19/5783 (2013.01); G01P 15/125 (2013.01); H01L 24/94 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/095 (2013.01); B81C 2203/031 (2013.01); H01L 21/561 (2013.01); H01L 23/315 (2013.01); H01L 2924/16235 (2013.01); Y10T 29/49146 (2015.01); Y10T 29/49826 (2015.01);
Abstract

An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. A movable memberof an acceleration sensorand a vibratorof an angular velocity sensorare fabricated on the same sensor waferwith a wallinterposed therebetween. A cap waferis formed in which gapscorresponding to the movable memberof the acceleration sensorand the vibratorof the angular velocity sensorare provided. Bumpsare disposed near the gapof the angular velocity sensor. The acceleration sensoris sealed at atmospheric pressure. Then, the angular velocity sensoris subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.


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