The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Apr. 07, 2009
Applicants:

Shuichi Inami, Tokyo, JP;

Ken Hamada, Tokyo, JP;

Hiroaki Taguchi, Tokyo, JP;

Takuya Yotsui, Tokyo, JP;

Takashi Atami, Tokyo, JP;

Inventors:

Shuichi Inami, Tokyo, JP;

Ken Hamada, Tokyo, JP;

Hiroaki Taguchi, Tokyo, JP;

Takuya Yotsui, Tokyo, JP;

Takashi Atami, Tokyo, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 15/20 (2006.01); C30B 15/14 (2006.01); C30B 15/10 (2006.01); C30B 35/00 (2006.01);
U.S. Cl.
CPC ...
C30B 15/14 (2013.01); C30B 15/10 (2013.01); C30B 15/20 (2013.01); C30B 15/206 (2013.01); C30B 35/00 (2013.01); Y10T 117/1068 (2015.01);
Abstract

A single crystal pulling apparatus comprises: a chamber; a crucible disposed within the chamber for containing a melt; a water-cooling means disposed within the chamber in such a manner as surrounding a single crystal pulled up from the melt in the crucible; water piping for feeding cooling water to and discharging the same from the water-cooling means; and supporting arms connected to the chamber for supporting the water-cooling means, wherein the supporting arms are disposed between the single crystal and the water piping. According to this configuration, the supporting arms can prevent the water piping from being damaged in the event of fall and collapse of the single crystal due to failure of the seed neck portion or in the event of rupture of the single crystal due to thermal stress, for instance.


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