The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Feb. 12, 2014
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Noboru Furuya, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); H01L 41/047 (2006.01); C23C 18/16 (2006.01); B41J 2/055 (2006.01); B41J 2/16 (2006.01); H01L 41/08 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/055 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1642 (2013.01); B41J 2/1645 (2013.01); B41J 2/1646 (2013.01); C23C 18/1651 (2013.01); H01L 41/0475 (2013.01); H01L 41/0805 (2013.01); H01L 41/0973 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14491 (2013.01);
Abstract
There is provided a liquid ejecting head including: a flow path formation substrate on which a pressure generation chamber communicating with nozzle openings for discharging liquid is provided; and a piezoelectric element which is provided on the flow path formation substrate and includes a piezoelectric layer, an electrode, and a wiring layer connected to the electrode, in which the wiring layer includes an adhesion layer which is provided on the electrode side and contains at least titanium and tungsten, and a conductive layer containing copper which is provided on a side of the adhesion layer opposite the electrode.