The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Nov. 19, 2009
Reiner Anton, Berlin, DE;
Brigitte Heinecke, Mülheim an der Ruhr, DE;
Michael Ott, Mülheim an der Ruhr, DE;
Christian Ressel, Zerf, DE;
Reiner Anton, Berlin, DE;
Brigitte Heinecke, Mülheim an der Ruhr, DE;
Michael Ott, Mülheim an der Ruhr, DE;
Christian Ressel, Zerf, DE;
SIEMENS AKTIENGESELLSCHAFT, München, DE;
Abstract
The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mold that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.