The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Oct. 02, 2014
Applicant:

Fuji Electric Fa Components & Systems Co., Ltd., Chuo-ku, Tokyo, JP;

Inventors:

Kokichi Okamoto, Ohtawara, JP;

Takahiro Taguchi, Kounosu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); H05K 13/04 (2006.01); H05K 3/30 (2006.01); B23K 1/20 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); B23K 1/20 (2013.01); H05K 3/303 (2013.01); H05K 3/3452 (2013.01); H05K 3/3442 (2013.01); H05K 2201/099 (2013.01); H05K 2201/2036 (2013.01);
Abstract

A method of mounting electronic parts on a surface mounting substrate includes a step of forming a film resist layer by applying a resist with a film coating device to amounting surface of a surface mounting substrate formed with a wiring pattern including a pair of lands to mount an electronic part; precuring the formed film resist layer; exposing, by using a mask, inner side regions of the film resist layer, the inner side regions defining the exposure regions and another region defining non-exposure region; etching away the film resist layer in the non-exposure regions and forming film resist layers in the inner side regions; post curing the film resist layers; printing solder pastes in regions on the lands excluding the inner side regions; and placing the electronic part on the solder pastes and reflow-soldering thereon.


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Okamoto, Kokichi. (2015). Method of mounting electronic parts on surface mounting substrate using a film resist standoff (U.S. Patent No. 9144186). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9144186

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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