The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Oct. 10, 2011
Applicants:

Sabine Schmideder, Wurmannsquick, DE;

Torsten Thelemann, Arnstadt, DE;

Josef Nagl, Kuenzing, DE;

Heinrich Aschenbrenner, Ortenburg, DE;

Reinhold Hoenicka, Ortenburg, DE;

Inventors:

Sabine Schmideder, Wurmannsquick, DE;

Torsten Thelemann, Arnstadt, DE;

Josef Nagl, Kuenzing, DE;

Heinrich Aschenbrenner, Ortenburg, DE;

Reinhold Hoenicka, Ortenburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 1/18 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H05K 3/40 (2006.01); H05K 3/32 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B81B 7/0006 (2013.01); B81C 1/00301 (2013.01); H05K 3/32 (2013.01); H05K 3/4046 (2013.01); B81B 2207/092 (2013.01); B81B 2207/096 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/185 (2013.01); H05K 3/3447 (2013.01); H05K 3/4629 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10356 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A sensor comprises a preferably multi-layer ceramic substrate () and at least one sensor element () arranged in, at, or on the ceramic substrate (). The sensor element () can be contacted via a metallic contact (), with the metallic contact () being produced via a soldering connection, which electrically connects the contact () with the sensor element () and here generates a fixed mechanic connection of the contact () in reference to the ceramic substrate (). Furthermore, a method is claimed for producing the sensor according to the invention.


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