The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Oct. 01, 2013
Applicant:
Shin-etsu Polymer Co., Ltd., Tokyo, JP;
Inventors:
Toshiyuki Kawaguchi, Tokyo, JP;
Kazutoki Tahara, Saitama, JP;
Tsutomu Saga, Saitama, JP;
Minoru Kubota, Saitama, JP;
Masashi Higuchi, Itoigawa, JP;
Assignee:
SHIN-ETSU POLYMER CO., LTD., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0277 (2013.01); H05K 1/0218 (2013.01); H05K 1/0257 (2013.01); H05K 9/0086 (2013.01); H05K 1/0393 (2013.01);
Abstract
A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.