The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Sep. 17, 2013
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yen-Chih Chang, New Taipei, TW;

Wei-Hung Hsu, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/627 (2006.01); H01R 13/24 (2006.01); H01R 13/41 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H01R 13/627 (2013.01); H01R 13/2442 (2013.01); H01R 13/2485 (2013.01); H01R 13/41 (2013.01); H05K 7/1069 (2013.01);
Abstract

An electrical contact () for electrically connecting an IC package having solder balls () with a substrate and includes a base portion (), a spring arm () extending upwardly from the base portion () and a rear portion () extending downwardly from the base portion (), the spring arm () defines a contact portion () at the end thereof to connect with the solder ball () of the IC package, the contact portion () includes a wide portion () with a width larger than other portions of the contact portion (), the wide portion () includes a pair of higher end portions () at opposite ends thereof and a lower middle portion () between the pair of end portions ().


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