The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9142822 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 22, 2015

Filed:

Nov. 29, 2010
Applicants:

Jintae Hong, Yongin-si, KR;

Jaeuk Ryu, Yongin-si, KR;

Inventors:

Jintae Hong, Yongin-si, KR;

Jaeuk Ryu, Yongin-si, KR;

Assignee:

Samsung SDI Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/04 (2006.01); H01M 2/20 (2006.01); H01M 10/42 (2006.01);
U.S. Cl.
CPC ...
H01M 2/202 (2013.01); H01M 10/425 (2013.01); Y10T 29/49108 (2015.01); Y10T 29/49211 (2015.01); Y10T 29/53135 (2015.01);
Abstract

A core pack manufacturing apparatus for preventing or substantially preventing an iron from contacting a cell or a protective circuit part in a process of soldering a connection tab of the cell to a connection terminal of the protective circuit part. A core pack manufacturing apparatus for soldering a connection tab connected to a cell to a connection terminal of a protective circuit part includes a cap including a first cover configured to cover the cell, and a second cover extending from a side of the first cover and configured to cover the protective circuit part, the second cover having an opening part configured to expose the connection tab and the connection terminal through the second cover for soldering.


Find Patent Forward Citations

Loading…