The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Jan. 17, 2013
Applicant:

Sanyo Electric Co., Ltd., Moriguchi, Osaka, JP;

Inventor:

Takahiro Mishima, Kobe, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H01L 31/0747 (2012.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); H01L 31/02167 (2013.01); H01L 31/02168 (2013.01); H01L 31/022441 (2013.01); H01L 31/0747 (2013.01); H01L 31/1804 (2013.01); Y02E 10/547 (2013.01);
Abstract

A second semiconductor layer is formed to cover a first principle surface of a semiconductor substrate including a insulating layer formed on the first principle surface. A portion of the second semiconductor layer formed on the insulating layer is partially removed by etching using a first etchant whose etching rate is higher for the second semiconductor layer than for the insulating layer. A portion of the insulating layer is removed by etching, through the removed portion of the second semiconductor layer, using a second etchant whose etching rate for the insulating layer is higher than that for the second semiconductor layer, thereby exposing apart of the first semiconductor layer. Electrodes are formed on the exposed part of the first semiconductor layer and the second semiconductor layer, respectively.


Find Patent Forward Citations

Loading…