The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Dec. 02, 2013
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Kenneth Allen Gerber, Santa Maria, CA (US);

Jonathan Getty, Goleta, CA (US);

Aaron M. Ramirez, Santa Barbara, CA (US);

Scott S. Miller, Lompoc, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 27/144 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 24/26 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 27/144 (2013.01); H01L 27/1465 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/8182 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81209 (2013.01);
Abstract

A method for bonding a first semiconductor body having a plurality of electromagnetic radiation detectors to a second semiconductor body having read out integrated circuits for the detectors. The method includes: aligning electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits; tacking the aligned electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits to form an intermediate stage structure; packaging the intermediate stage structure into a vacuum sealed electrostatic shielding container having flexible walls; inserting the package with the intermediate stage structure therein into an isostatic pressure chamber; and applying the isostatic pressure to the intermediate stage structure through walls of the container. The container includes a stand-off to space walls of the container from edges of the first semiconductor body.


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