The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Jan. 24, 2014
Applicants:

Yi-chang Chang, Hsin-Chu, TW;

Yen-hsin Chen, Hsin-Chu, TW;

Chi-chih Shen, Hsin-Chu, TW;

Inventors:

Yi-Chang Chang, Hsin-Chu, TW;

Yen-Hsin Chen, Hsin-Chu, TW;

Chi-Chih Shen, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 27/146 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/3114 (2013.01); H01L 23/3192 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 27/14618 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 29/0657 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/17519 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A chip package includes: a semiconductor chip having an upper surface and a lower surface opposite to each other, the semiconductor chip including an image sensor circuit; a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip; a bond pad formed on the upper surface, for electrically connecting with the image sensor circuit in the semiconductor chip, wherein the metal heat conductive layer conducts or absorbs heat generated by the semiconductor chip, to thereby reduce temperature of the image sensor circuit in the semiconductor chip and improve the performance of the circuit, wherein the metal heat conductive layer entirely covers the lower surface.


Find Patent Forward Citations

Loading…