The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Nov. 20, 2013
Applicants:

DO Hyun Park, Uiwang-si, KR;

Kyu Bong Kim, Uiwang-si, KR;

Woo Jun Lim, Uiwang-si, KR;

Inventors:

Do Hyun Park, Uiwang-si, KR;

Kyu Bong Kim, Uiwang-si, KR;

Woo Jun Lim, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 23/00 (2006.01); C09J 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 9/02 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/293 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/07811 (2013.01);
Abstract

A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.


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