The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Apr. 01, 2013
Applicant:
Fujitsu Limited, Kawasaki-shi, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01); H01L 23/34 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 21/50 (2006.01); H05K 1/02 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/50 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/427 (2013.01); H05K 1/0203 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0204 (2013.01); H05K 2201/09072 (2013.01);
Abstract
A semiconductor package includes a substrate with a first surface on which a semiconductor device is mounted and a second surface opposite to the first surface, and a loop heat pipe including an evaporator and attached to the second surface of the substrate, wherein the substrate has a groove structure in the second surface, the groove structure being in contact with a porous wick provided in the evaporator.