The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Mar. 15, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

John C. Ehmke, Garland, TX (US);

Virgil C. Ararao, Plano, TX (US);

Toby R. Linder, Dallas, TX (US);

Lance W. Barron, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G02B 26/08 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G02B 26/0833 (2013.01); B81C 1/00317 (2013.01);
Abstract

A hermetic package comprising a substrate () having a surface with a MEMS structure () of a first height (), the substrate hermetically sealed to a cap () forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack () of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (); the stack having a bottom metal seed film () adhering to the substrate with a first width (), and further a top metal seed film () adhering to the cap with a second width () smaller than the first width, the top metal seed film tied to a layer () including gold-indium intermetallic compounds, layer () having a height greater than the first height.


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