The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Feb. 18, 2013
Taiwan Ic Packaging Corporation, Kaohsiung, TW;
Upi Semiconductor Corp., Hsinchu County, TW;
Yi-Hua Chang, Kaohsiung, TW;
Sue-Ping Lin, Kaohsiung, TW;
Chun-Chi Chen, Kaohsiung, TW;
Tsung-Yu Hung, Kaohsiung, TW;
TAIWAN IC PACKAGING CORPORATION, Kaohsiung, TW;
uPI semiconductor corp., Zhubei, Hsinchu County, TW;
Abstract
The present invention is an optical proximity sensor and manufacturing method thereof. The optical proximity sensor has an optical sensing unit, an illuminating unit, multiple transparent gels and a package. The package encapsulates the optical sensing unit and the illuminating unit. The transparent gels are respectively formed on top surfaces of the optical sensing unit and the illuminating unit. The transparent gels respectively have a convex part and a recess formed in the convex part. The package has through holes communicating with the recesses of the transparent gels to form openings. In a step of injecting encapsulant gel, because the transparent gels are still plastic, the protrusions can closely attach to the transparent gels. The encapsulant gel is prevented from forming above the sensing part and the illuminating part.