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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9139687 B1

PDFFull Text
Date of Patent:
Sep. 22, 2015

Filed:

Aug. 27, 2009

Soluble imide skeleton resin, soluble imide skeleton resin solution composition, curable resin composition, and cured product thereof

Applicants:

Takayoshi Hirai, Yokkaichi, JP;

Tetsurou Imura, Tokyo, JP;

Makoto Takahashi, Yokkaichi, JP;

Inventors:

Takayoshi Hirai, Yokkaichi, JP;

Tetsurou Imura, Tokyo, JP;

Makoto Takahashi, Yokkaichi, JP;

Assignee:

Mitsubishi Chemical Corporation, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Rachel Kahn

Int. Cl.
CPC ...
H01B 1/22 (2006.01); C08L 79/08 (2006.01); C08G 73/10 (2006.01); C08G 59/22 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); C08G 59/06 (2006.01); C08G 59/26 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C08G 59/22 (2013.01); B32B 7/12 (2013.01); B32B 15/20 (2013.01); C08G 59/066 (2013.01); C08G 59/26 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08G 73/10 (2013.01); C08G 73/105 (2013.01); C08G 73/1039 (2013.01); C08G 73/1064 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08L 63/00 (2013.01); C08L 79/08 (2013.01); H05K 1/0353 (2013.01); H05K 3/4626 (2013.01);
Abstract

An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.

Find Patent Forward Citations

Hirai, Takayoshi. (2015). Soluble imide skeleton resin, soluble imide skeleton resin solution composition, curable resin composition, and cured product thereof (U.S. Patent No. 9139687). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9139687

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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