The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Feb. 19, 2013
Honeycomb structure comprising a cement skin composition with crystalline inorganic fibrous material
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Thomas Richard Chapman, Painted Post, NY (US);
Huthavahana Kuchibhotla Sarma, Painted Post, NY (US);
John Forrest Wight, Jr., Corning, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01D 46/24 (2006.01); C04B 14/38 (2006.01); C04B 38/00 (2006.01); C04B 14/46 (2006.01); B32B 3/12 (2006.01); C04B 41/85 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); F01N 3/022 (2006.01); C04B 111/00 (2006.01); F01N 3/28 (2006.01);
U.S. Cl.
CPC ...
C04B 38/0009 (2013.01); B01D 46/2429 (2013.01); B32B 3/12 (2013.01); C04B 14/38 (2013.01); C04B 14/465 (2013.01); C04B 41/009 (2013.01); C04B 41/5089 (2013.01); C04B 41/85 (2013.01); B01D 46/247 (2013.01); B01D 46/2444 (2013.01); C04B 2111/00793 (2013.01); C04B 2235/526 (2013.01); C04B 2235/5264 (2013.01); C04B 2235/9607 (2013.01); F01N 3/0222 (2013.01); F01N 3/2828 (2013.01); Y10T 428/24149 (2015.01);
Abstract
Disclosed is a honeycomb support structure comprising a honeycomb body and an outer layer or skin formed of a cement that includes an inorganic filler material having a first coefficient of thermal expansion from 25° C. to 600° C. and a crystalline inorganic fibrous material having a second coefficient of thermal expansion from 25° C. to 600° C.