The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Nov. 22, 2011
Keigo Sugai, Nagano, JP;
Seigo Momose, Nagano, JP;
Keigo Sugai, Nagano, JP;
Seigo Momose, Nagano, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
The printed matter manufacturing method includes the steps of providing a printed layer in a predetermined pattern on a substrate, and providing an open part penetrating through the substrate and the printed layer in an open part formation region. The printed matter manufacturing method has a step of providing a buffer layer for mitigating a shock imparted to the printed layer when the open part is provided, so that the buffer layer contacts the printed layer in at least a portion of a periphery of the open part formation region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile