The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Mar. 15, 2011
Applicants:
Jarrett Dumond, Singapore, SG;
Hong Yee Low, Singapore, SG;
Inventors:
Jarrett Dumond, Singapore, SG;
Hong Yee Low, Singapore, SG;
Assignee:
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B82Y 40/00 (2011.01); B32B 38/06 (2006.01); B29C 65/00 (2006.01); B82Y 20/00 (2011.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B32B 38/06 (2013.01); B29C 66/91943 (2013.01); B29C 66/91945 (2013.01); B82Y 20/00 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2309/105 (2013.01); B32B 2309/12 (2013.01); B32B 2457/206 (2013.01); Y10T 156/1039 (2015.01); Y10T 428/2462 (2015.01); Y10T 428/2998 (2015.01);
Abstract
There is provided a process for forming a laminated structure, the process comprising the step of bonding a polymer film to an array of structures disposed on a substrate, and wherein a plurality of cavities are formed between the polymer film and the array of structures during the bonding.