The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Apr. 14, 2014
Applicant:

Prior Company Limited, Taipei, TW;

Inventor:

Jui-Hua Yen, New Taipei, TW;

Assignee:

Prior Company Limited, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); B29C 35/08 (2006.01); B29K 101/12 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14827 (2013.01); B29C 35/0805 (2013.01); B29C 45/1671 (2013.01); B29C 2035/0827 (2013.01); B29K 2101/12 (2013.01); B29L 2007/008 (2013.01);
Abstract

Manufacturing method of decorated molding article is provided. The manufacturing method of decorated molding article includes the following steps. A hard coating layer is formed on a substrate. The hard coating layer has an uneven surface and a planar surface, wherein the substrate contacts with the planar surface. A pattern layer is formed on and completely covers the uneven surface of the hard coating layer. An adhesive layer is formed on the pattern layer so as to form a decoration film. A transfer molding process is performed such that the decoration film adheres to an article through the adhesive layer. The transfer molding process includes performing a heating procedure such that the substrate is separated from the planar surface of the hard coating layer.


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