The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

Aug. 08, 2014
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventor:

Robert Jon Carlson, Brooklyn Park, MN (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); B29C 33/38 (2006.01); H01L 21/306 (2006.01); C23F 1/02 (2006.01); B81C 99/00 (2010.01); B29C 41/00 (2006.01); B29C 59/14 (2006.01); B29C 59/16 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/3842 (2013.01); B29C 41/00 (2013.01); B29C 59/14 (2013.01); B29C 59/16 (2013.01); B81B 7/00 (2013.01); B81C 99/009 (2013.01); C23F 1/02 (2013.01); H01L 21/30604 (2013.01); H05K 999/00 (2013.01); B29K 2909/00 (2013.01); B29K 2995/0037 (2013.01); B81B 2201/05 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0127 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0143 (2013.01); B81C 2201/034 (2013.01); Y10T 428/24496 (2015.01);
Abstract

The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.


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