The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2015

Filed:

May. 25, 2012
Applicants:

Go Otani, Otake, JP;

Yusuke Nakai, Otake, JP;

Satoru Ozawa, Otake, JP;

Inventors:

Go Otani, Otake, JP;

Yusuke Nakai, Otake, JP;

Satoru Ozawa, Otake, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 5/02 (2006.01); B29C 59/04 (2006.01); B29C 33/60 (2006.01); B29C 39/14 (2006.01); G02B 1/118 (2015.01); B29C 35/08 (2006.01); B29C 59/02 (2006.01); B29C 33/42 (2006.01);
U.S. Cl.
CPC ...
B05D 5/02 (2013.01); B29C 33/60 (2013.01); B29C 39/148 (2013.01); B29C 59/046 (2013.01); G02B 1/118 (2013.01); B29C 33/424 (2013.01); B29C 2035/0827 (2013.01); B29C 2059/023 (2013.01);
Abstract

A method for preparing an article having an uneven microstructure on a surface thereof, including coating a surface of a mold having an uneven microstructure formed from an anodized alumina oxide on a surface with a release treatment solution including a mold release agent that includes one or more kinds of phosphoric ester compound and the pH of the aqueous solution when extracted with 50 mL of water with respect to 1 g of the mold release agent is 3.0 or more; and interposing an active energy ray curable resin composition including a polymerizable compound, a polymerization initiator, and an internal release agent between the mold and the substrate, and curing the active energy ray curable resin composition by the irradiation with active energy rays to form a cured resin layer having the uneven microstructure transferred on a surface of the substrate.


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