The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Nov. 21, 2013
Applicant:
Seiko Instruments Inc., Chiba, JP;
Inventor:
Atsushi Kozuki, Chiba, JP;
Assignee:
SEIKO INSTRUMENTS INC., Chiba, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/00 (2013.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H03H 9/10 (2006.01); H05K 3/40 (2006.01); H01L 41/29 (2013.01); H05K 3/24 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H03H 9/1014 (2013.01); H03H 9/1021 (2013.01); H03H 9/1057 (2013.01); H05K 3/4007 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 41/29 (2013.01); H01L 2924/0002 (2013.01); H05K 3/243 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10083 (2013.01); H05K 2203/072 (2013.01); H05K 2203/1147 (2013.01); Y10T 29/4913 (2015.01);
Abstract
An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face.