The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Jan. 11, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Dong Uk Lee, Chungwon-gun, KR;
Tae Seong Kim, Chungwon-gun, KR;
Young Gon Kim, Ulsan, KR;
Seung Hyun Noh, Daejeon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H05K 3/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 1/113 (2013.01); H05K 3/00 (2013.01); H05K 3/3452 (2013.01); H05K 3/3457 (2013.01); H05K 3/3463 (2013.01); H05K 3/4007 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01); H05K 3/0097 (2013.01); H05K 3/4038 (2013.01); H05K 2201/099 (2013.01); H05K 2203/041 (2013.01); H05K 2203/049 (2013.01); H05K 2203/1536 (2013.01);
Abstract
The present invention relates to a printed circuit board which includes: a solder pad on which a solder ball is mounted; an insulator formed on the solder pad; and a protrusion formed under the insulator to support the solder ball when mounting the solder ball and can stably mount the solder ball.