The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Mar. 16, 2012
Applicants:

Peter DE Dobbelaere, San Diego, CA (US);

Thierry Pinguet, Vashon, WA (US);

Mark Peterson, San Diego, CA (US);

Mark Harrison, Escondido, CA (US);

Alexander G. Dickinson, Laguna Beach, CA (US);

Lawrence C. Gunn, Encinitas, CA (US);

Inventors:

Peter De Dobbelaere, San Diego, CA (US);

Thierry Pinguet, Vashon, WA (US);

Mark Peterson, San Diego, CA (US);

Mark Harrison, Escondido, CA (US);

Alexander G. Dickinson, Laguna Beach, CA (US);

Lawrence C. Gunn, Encinitas, CA (US);

Assignee:

Luxtera, Inc., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); H04B 10/40 (2013.01); G02B 6/42 (2006.01); G02B 6/38 (2006.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/4214 (2013.01); G02B 6/4246 (2013.01); G02B 6/3885 (2013.01);
Abstract

A transceiver comprising a plurality of CMOS chips, a first chip comprising optical and optoelectronic devices and at least a second chip comprising electronic devices may be operable to communicate an optical source signal from a semiconductor laser into the first CMOS chip. The optical source signal may be used to generate first optical signals that may be transmitted from the first CMOS chip to optical fibers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The first optical signals may be communicated from the first CMOS chip via optical couplers, which may comprise grating couplers.


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