The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Jun. 05, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JO;
Inventor:
Osamu Ishii, Tatsuno, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H03H 3/04 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H03B 5/32 (2013.01); H03H 3/04 (2013.01); H03H 9/02157 (2013.01); H03H 9/0542 (2013.01); H03H 9/1021 (2013.01);
Abstract
A resonator element includes a substrate including a vibrating portion that performs thickness-shear vibration and an excitation electrode provided on top and bottom main surfaces of the vibrating portion. Assuming that the average plate thickness calculated from the plate thicknesses of a plurality of regions of the vibrating portion is H and the plate thickness difference, which is a difference between the maximum and minimum values of the plate thicknesses of the plurality of regions of the vibrating portion, is ΔH, 0%<ΔH/H≦0.085% is satisfied as a relationship between H and ΔH.