The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Nov. 22, 2011
Applicants:
Joern Jacob, Kirnbach, DE;
Holger Gruhler, Tuningen, DE;
Inventors:
Joern Jacob, Kirnbach, DE;
Holger Gruhler, Tuningen, DE;
Assignee:
VEGA GRIESHABER KG, Wolfach, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H05K 3/36 (2006.01); H01L 41/29 (2013.01); H01L 41/293 (2013.01); G01F 23/296 (2006.01); H01L 41/047 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 41/29 (2013.01); G01F 23/2965 (2013.01); G01F 23/2967 (2013.01); G01F 23/2968 (2013.01); H01L 41/0475 (2013.01); H01L 41/22 (2013.01); H01L 41/293 (2013.01); H05K 1/189 (2013.01); B41J 2202/18 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01); H05K 3/321 (2013.01); H05K 3/326 (2013.01); H05K 3/3478 (2013.01); H05K 3/363 (2013.01); Y10T 29/42 (2015.01);
Abstract
A method of manufacturing a conductive adhesive bond assembly consisting of a piezoactuator and a printed circuit board that are connected by at least one adhesive connection, with at least one electrical connection created by an electrically conductive adhesive between a first connection contact on the printed circuit board and between a second connection contact on the piezoactuator, whereby the connection contacts face in the same direction and the adhesive connection takes place through an opening in one of the components.