The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Jun. 23, 2014
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Young Rak Park, Daejeon, KR;

Sang Choon Ko, Daejeon, KR;

Woojin Chang, Daejeon, KR;

Jae Kyoung Mun, Daejeon, KR;

Sung-Bum Bae, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/49 (2006.01); H01L 29/417 (2006.01); H01L 29/778 (2006.01); H01L 29/737 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/41725 (2013.01); H01L 29/49 (2013.01); H01L 29/66431 (2013.01); H01L 29/737 (2013.01); H01L 29/778 (2013.01);
Abstract

Provided is a nitride semiconductor device including: a substrate having through via holes; first and second nitride semiconductor layers sequentially stacked on the substrate; drain electrodes and source electrodes provided on the second nitride semiconductor layer; and an insulating pattern provided on the second nitride semiconductor layer, the insulating pattern having upper via holes provided on the drain electrodes, wherein the through via holes are extended into the first and second nitride semiconductor layers and expose a bottom of each of the source electrodes.


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