The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9136225 B1

Date of Patent:

Sep. 15, 2015

Filed:

May. 04, 2015

Semiconductor device manufacturing method

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventor:

Yoshihiro Kodaira, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.

CPC ...

H01L 23/544 (2006.01); H01L 23/31 (2006.01); H01L 23/14 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 29/66 (2006.01); H01L 23/34 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 23/053 (2006.01); H01L 23/36 (2006.01);

U.S. Cl.

CPC ...

H01L 23/544 (2013.01); H01L 21/56 (2013.01); H01L 23/147 (2013.01); H01L 23/29 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 29/66325 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/49811 (2013.01);

Abstract

A method of manufacturing a semiconductor device, includes the steps of passing a control terminal through an opening of a resin case to partially expose the control terminal and covering a patterned insulating substrate with the resin case; inserting a resin block in the opening of the resin case; fitting a convex step portion formed on a side surface of the resin block into a valley formed between two projections of the control terminal; fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case; and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal.

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