The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Dec. 05, 2011
Applicant:

Tsutomu Takeda, Tokyo, JP;

Inventor:

Tsutomu Takeda, Tokyo, JP;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 29/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/15311 (2013.01);
Abstract

An interposer includes a substrate includes a plurality of penetrating electrodes, and a wiring portion formed on the substrate, in which the wiring portion includes a wiring layer electrically connected to the penetrating electrodes and an insulating layer covering the wiring layer. The interposer includes a plurality of first UBM structures provided at a side opposite the substrate of the wiring portion, in which the first UBM structures are electrically connected to the wiring layer. The interposer includes a plurality of bumps provided at the side opposite the wiring portion of the substrate, in which the plurality of bumps is electrically connected to each of the penetrating electrodes via a plurality of second UBM structures.


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