The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Jul. 13, 2012
Applicants:

Kouichi Inoue, Ama-gun, JP;

Kazuyoshi Maeda, Ama-gun, JP;

Norihito Shibuya, Ama-gun, JP;

Inventors:

Kouichi Inoue, Ama-gun, JP;

Kazuyoshi Maeda, Ama-gun, JP;

Norihito Shibuya, Ama-gun, JP;

Assignee:

SINTOKOGIO, LTD., Nagoya-shi, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01J 37/317 (2006.01); H01L 21/265 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01J 37/3171 (2013.01); H01L 21/265 (2013.01); H01L 21/67288 (2013.01); H01L 21/6838 (2013.01); H01L 22/20 (2013.01); H01L 33/0095 (2013.01); H01L 22/12 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A warp correction apparatus includes an injection mechanism including a nozzle that performs injection treatment, an adsorption table that holds the substrate by adsorption at a principal surface side or a film surface side, a moving mechanism that moves the adsorption table so that the substrate relatively moves with respect to an injection area of an injection particle by the nozzle, an injection treatment chamber that houses the substrate held on the adsorption table and in the interior of which injection treatment is performed, a measurement mechanism that measures a warp of the substrate, and a control device that, based on a difference between a target warp amount and a warp amount measured by the measurement mechanism, performs at least either one of a setting processing of an injection treatment condition of the injection mechanism and an accept/reject determination of the substrate for which injection treatment has been performed.


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