The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2015
Filed:
Jan. 23, 2013
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
A method of manufacturing a semiconductor device, includes: providing an adhesive layer on a support body; providing a semiconductor element on the adhesive layer; providing a resin layer on the adhesive layer, the semiconductor element being provided on the adhesive layer, and forming a substrate on the adhesive layer, the substrate including the semiconductor element and the resin layer; and removing the substrate from the adhesive layer, wherein an adhesive force of the adhesive layer in a direction in which the substrate is removed is less than an adhesive force of the adhesive layer in a planar direction in which the substrate is formed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile