The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Sep. 19, 2013
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Thoralf Kautzsch, Dresden, DE;

Heiko Fröhlich, Radebeul, DE;

Mirko Vogt, Dresden, DE;

Maik Stegemann, Pesterwitz, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); G01N 33/487 (2006.01); G01N 27/414 (2006.01); G01N 27/447 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); G01N 27/414 (2013.01); G01N 27/4473 (2013.01); G01N 33/48721 (2013.01); H01L 29/06 (2013.01);
Abstract

Embodiments relate to structures, systems and methods for more efficiently and effectively etching sacrificial and other layers in substrates and other structures. In embodiments, a substrate in which a sacrificial layer is to be removed to, e.g., form a cavity comprises an etch dispersion system comprising a trench, channel or other structure in which etch gas or another suitable gas, fluid or substance can flow to penetrate the substrate and remove the sacrificial layer. The trench, channel or other structure can be implemented along with openings or other apertures formed in the substrate, such as proximate one or more edges of the substrate, to even more quickly disperse etch gas or some other substance within the substrate.


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