The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Jul. 15, 2013
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonngi-Do, KR;

Inventors:

Ki Yong Song, Seoul, KR;

Sung Hen Cho, Seoul, KR;

Sang Eun Park, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/30 (2006.01); H01B 13/00 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/31 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H01L 27/12 (2006.01); G02F 1/1362 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01B 13/0026 (2013.01); C23C 18/1605 (2013.01); C23C 18/1692 (2013.01); C23C 18/1696 (2013.01); C23C 18/1889 (2013.01); C23C 18/30 (2013.01); C23C 18/31 (2013.01); H01L 27/124 (2013.01); H01L 27/1255 (2013.01); H05K 3/108 (2013.01); H05K 3/24 (2013.01); G02F 2001/136295 (2013.01); H05K 3/388 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0716 (2013.01); Y10T 428/24917 (2015.01);
Abstract

Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.


Find Patent Forward Citations

Loading…