The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Nov. 11, 2011
Applicants:

Jonathan Kennett, Glasgow, GB;

John Cunningham, Glasgow, GB;

Robert Gibson, Glasgow, GB;

Inventors:

Jonathan Kennett, Glasgow, GB;

John Cunningham, Glasgow, GB;

Robert Gibson, Glasgow, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2012 (2013.01); G03F 7/2035 (2013.01); H05K 3/0082 (2013.01); H05K 3/064 (2013.01); H05K 3/3452 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1545 (2013.01); Y10T 428/24802 (2015.01);
Abstract

There is herein described a method and apparatus for photoimaging. More particularly, there is described a method and apparatus for photoimaging a substrate (e.g. a web) covered with a wet curable photopolymer wherein a rotatable phototool is pressed and rotated against the substrate to create an imaged substrate which is used to form images suitable for forming electrical circuits such as for printed circuit boards (PCBs), flat panel displays and flexible circuits. There is also described a method and apparatus for directly photoimaging a substrate covered with a wet curable photopolymer, wherein the photoimaged substrate is used to form images such as electrical circuits and a method and apparatus for exposing at least part of a solder mask on a printed circuit board (PCB) using a wet curable photopolymer wherein an imaging process may thereafter occur on the area above the solder mask.


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